單面/雙面Single/Double Sided P.C.B | ||
最大加工面積Max Board Size |
| 400*900mm |
板厚Board Thickess |
| 0.4mm - 3.0mm |
銅厚Copper Thickess |
| 18um、36um、72um |
基材Base Material |
| FR-4、CEM-1、CEM-3、鋁基板 |
最小線寬The Min Track |
| 0.2mm(1±15%) |
最小間隙The Min Clearence |
| 0.2mm(1±15%) |
最小孔徑The Min Cliameter |
| 0.3mm±0.1mm |
孔壁厚度Hole Plating Thickness |
| ≥18um |
金屬化孔孔徑公差PTH Hole Tolerance | >∮0.8 | ±0.10mm |
≤∮0.8 | ±0.05mm | |
孔位公差Hole Position Deviation |
| ±0.080mm |
外型尺寸公差Outline Tolerance |
| ±0.20mm |
絕緣電阻Insulation Resistance |
| ≥10^12歐姆（常態） |
孔電阻Through Hole Resisance |
| ≤300歐姆 |
抗電強度Dielectric Strcemgth |
| ≥1.6kv/mm |
耐電流Current Breakdown |
| 10A |
抗剝強度Peet-off Strength |
| 1.5N/mm |
阻焊劑硬度Solder Mask Abrasion |
| >5H |
熱沖擊Thermal Strenss |
| 288 C+5 C,10ses |
自熄性Inflannabikity |
| 94V-0 |
通斷測試電壓E-Test Voltage |
| 10-250V |
焊盤拉脫強度Pull of Strength of Peels |
| >100N |
可焊性Sloder Ability |
| 235℃+55℃在3S內濕潤 |
翹曲度Bow and Twist |
| ≤0.75% |
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