華邦電子印制電路板技術指標

單面/雙面Single/Double Sided P.C.B

最大加工面積Max Board Size           

400*900mm

板厚Board Thickess

0.4mm - 3.0mm

銅厚Copper Thickess

18um、36um、72um

基材Base Material

FR-4、CEM-1、CEM-3、鋁基板

最小線寬The Min Track

0.2mm(1±15%)

最小間隙The Min Clearence

0.2mm(1±15%)

最小孔徑The Min Cliameter

0.3mm±0.1mm

孔壁厚度Hole Plating Thickness

≥18um

金屬化孔孔徑公差PTH Hole Tolerance

>∮0.8

±0.10mm

≤∮0.8

±0.05mm

孔位公差Hole Position Deviation

±0.080mm

外型尺寸公差Outline Tolerance

±0.20mm

絕緣電阻Insulation Resistance

≥10^12歐姆（常態）

孔電阻Through Hole Resisance

≤300歐姆

抗電強度Dielectric Strcemgth

≥1.6kv/mm

耐電流Current Breakdown

10A

抗剝強度Peet-off Strength

1.5N/mm

阻焊劑硬度Solder Mask Abrasion

>5H

熱沖擊Thermal Strenss

288 C+5 C,10ses

自熄性Inflannabikity

94V-0

通斷測試電壓E-Test Voltage

10-250V

焊盤拉脫強度Pull of Strength of Peels

>100N

可焊性Sloder Ability

235℃+55℃在3S內濕潤

翹曲度Bow and Twist

≤0.75%