產品品牌：三工

產品型號：SDS50A

工作電壓：380v /220v

半導體激光劃片機系列Diode pump laser scribing-cell machine series SDS50A  設備性能該類機型采用半導體泵浦激光器，一體化程度更高、光束質量更好、運行成本更低、免維護時間更長；關鍵部件均采用進口產品，整機結構簡單、劃片速度快、精度更高，能24小時長期連續工作。  應用領域太陽能行業單晶硅、多晶硅、非晶硅帶太陽能電池片（cell）和硅片（wafer）的劃片（切割切片）；電子行業單晶硅和多晶硅硅片（wafer）的分離切割。  主要技術參數

型號規格	SDS50A
激光波長	1.064μm
激光最大功率	≥50W
激光重復頻率	200Hz~50kHz
劃片線寬	≤30μm
最大劃片速度	140mm/s
劃片精度	≤±10μm
工作臺幅面	350×350mm
工作電源	380V（220V）/50Hz/5kVA
冷卻方式	外掛式恒溫循環水冷
工作臺	雙氣倉負壓吸附，T型臺雙工位交替工作

            Equipment Performance:This machine adopts the diode pump laser, it has the characters of higher integrative degree, better quality of laser beam, lower running cost and little maintenance during long time;Imported key spare parts, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24 hours.  Applicable fieldsScribing for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry;Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.  The main technical parameters

Type specification	SDS50A
Laser wavelength	1.064μm
Laser max power	≥50W
Laser repetition frequency	200Hz~50kHz
Scriber line width	≤30μm
Max scriber speed	140mm/s
Scriber precision	≤±10μm
Work platform size	350×350mm
Power supply	380V（220V）/50Hz/5kVA
Cooling way	Outside suspension type constant temperaturecirculation water cooling
Work platform	The adsorption of double gas warehouse vacuum, the T model platform is double position works in turn