2D非接觸式測厚機YL-881
Laser Vision Measurement 品管量測設備
產品特性（FEATURES）
◆使用Window’s視窗介麵，中/英文化書麵，操作簡單。
◆手動量測錫膏厚度
◆手動測量長、寬及兩錫膏間之距離（間距）
◆測量值可記錄存檔及列印
◆提供厚度分佈統計圖表及X_Bar_R管制表
◆自動計算制程能力指標CP、CPK、CPM
◆可依不同生產線分別作記錄
◆可依基板厚度調整焦距
◆可做定時呼叫取樣
◆All operations are easy and using Windows interface in Chinese/English version.
◆Survey thickness of tin solder by auto matica lly or manually.
◆Survey the length and width manually,and the gap of tin solder.
◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
◆All surveyed values can be recorded to a file and be printed to a report.
◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
◆Calculate man facture ability degree automatically(CP, CPK, CPM)
◆It can have proprietary record according to every different production ling.
◆It can adjust focus point in different thickness of PC boards.
◆It can be called to sample periodically.
適用（APPLECATION）
◆各式厚度量測數值取得統計分析
◆錫膏印刷機制程品管檢查
◆錫膏印刷厚度良性測量
◆錫膏印刷成型，尺寸量測檢查
◆提供其他物品測厚，測長，量測檢查
◆Get the results of statistics and analysis about all surveyed values in every thickness degree.
◆Inspect the quality of solder printing process.
◆Survey the thickness benignancy of tin solder
◆Measure the dimension of tin solder
◆Provide thickness and dimension measurement function for other objects
功能（FUNCTION）
◆量測印刷錫膏厚度、長度、高度、間距。
◆提供厚度分佈數值參考。
◆提供各種統計分析圖表
X管制圖、 R管制圖、厚度列表
X平均值管制圖 單點列表
◆Surveying the thickness of printing tin solder, length ,height and interval.
◆Provide the references of thickness distribution values.
◆Provide the analysis of different measure of cross-section.
◆Calculate the measure of area and volumn automatically in object which to be surveyed.
◆Provide all diagrams of statistics and analysis.
Provide X control Diagram, R Control Diagram
and Thickness List Diagram. Provide X Average
Control Diagram, Single Point List Diagram.
新手教學
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