本公司生產系列船形開關:帶燈,不帶燈,還有各種端子的 使用開關時註意事項
1.IN CASE AN AUTOMATIC FLOW SOLDERING APPARATUS IS USE FOR SOLDERING
用自動焊接設備焊接時應參照如下條件
ITEM項 目 | SOLDERING CONDITIONS焊接條件 |
(1)PREHEAT TEMPERATURE預熱溫度 | 100℃ MAX(AMBIENT TEMPERATURE OF PRINTED CIRCUIT BOARD ON ITS SOLDERING SIDE)(電路板周圍焊錫麵的溫度) |
(2)PREHEAT TIME預熱時間 | 45 SEC MAX45秒MAX |
(3)FLUX FOAMING助焊劑浸泡 | TO SUCH AN EXTENT THAT FLUX WILL BE KEPT FLUSH WITH THE PRINTED CIRCUIT BOARDS,TOP SURFACE ON WHICH COMPonENTS ARE MOUNTED.PRDPARATORY FLUX MUST NOT BE APPLIED TO THAT SODE OF PRINTED CIRCUIT BOARD ON WHICH COMPonENTS ARE MOUNTED AND TO THE AREA WHIERE TERMINALS ARE LOCATED.助焊劑應塗在電路板上組裝開關的印刷麵上半部位，應防止助焊劑過量到電路板. |
(4)SOLDERINTEMPERATURE 焊錫溫度 | 255℃ MAX255℃ MAX
|
(5)DURATION OF SOLDER IMMERSION焊接時間 | 5 SEC MAX5秒 MAX |
(6)ALLOWABLEPREQUENCY 允許重焊次數 | 2 TIMES MAX2次 MAX |
2.OTHER PRECAUTIONS其他註意事項
(1) FOLLOWING THE SOLDERING PROCESS,DO NOT TRY TO CLEAN THE SWITCH SOLVENT OR THE LIKE
進行焊接工藝時不應使用不整潔的東西對開關進行清潔。
(2) SAFEGUARD THE SWITCH ASSEMBLY AGAINST FLUX PENETRA TION FROM ITS TOP SIDE
在組裝開關時應防止助焊劑從開關的上部流入到開關內部
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