MINI DP夾板式母座

    Note:

           ConTACT RESISTANCE: 20M ohm  MAXINUN INITIAL,

       INSULATION RESISTANCE: 100M ohm MINMUM,

        DIELECTIC WITHSTANDING 300 VAC.

              RATING VDTAGE, 50 VAC(R,M,S)

              RAYING GURRENT 0.5 AMPERE, MAXIMUM

                        PER ConTACT AT 30 C T-RISE

              RATING TEMPERATURE: -40℃ TD +85℃

  MATERIAL:

                  CONTACT: C2680-H,T=0.3mm,TIN PLATING ON SOLDER TAIL,GOLD PLATING OVER NICKEL ON ConTACT AREA

       INSERTION(MODING): LCP，BLACK

       BODY: LCP,WHITE

       SHELL: C5191-H,T=0.3mm,NICKLE OR GOLD PLATING  

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