A full range of cell processing, including

· Mono- and Multi-crystalline Silicon-based cells

· 6 inch cell size with 2 busbars and 3 busbars

· Wafer thickness of 180 to 200 µm

High efficiency and thin wafer handling capabilities

· Dynamic optimized setting system

· Soft-touch wafer handling system

Robust-in-house automation systems

· Improved quality, efficiency and yield increase

· Highly automated wafer transport system

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