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Adhesives·Conductives·Encapsulants

	Technical Data Sheet
	DA-5193
	Die Attach Adhesive for LEDs

Description

DA-5193is a high adhesion, electrically-conductive adhesive for attaching LEDs to metallic substrates. DA-5193exhibits a variety of rapid cure options, while providing room temperature stability. In addition, the DA-5193exhibits very low out-gassing upon cure, while providing low bleed-out on most metallic substrates.

Advantages

a Rapid cure	a Low temperature cure
a Low volatiles	a Excellent conductivity

Typical

Uncured

Properties

Property	Test Method	Typical Value
Viscosity (HB-DV-III+ Spindle #51)	TP 125 0.5 rpm	90,000 cP
Viscosity (HB-DV-III+ Spindle #51)	TP 125 5.0 rpm	18,000 cP
Thix ratio	(0.5 rpm/5.0 rpm)	~5.0
Specific gravity	ASTM D 792	3.3
Color	Visual	Silver
Pot life (25°C)	25% increase in viscosity (closed container)	> 1 wk
Open time (25°C)	Thin film (screen, stencil, ect.)	16 hrs
Shelf life (0°C)		3 months
Shelf life (-40°C)		12 months
Weight loss on cure		<1.5%

Cure

Schedule

Recommended cure schedules are based on differential scanning calorimetery (DSC) scans and measurement of critical physical properties for the material. Ramp times to the particular cure temperatures are not included. The user should ensure that the material is subjected to cure time and temperature in the table, below.

Cure Temperature	Cure Time (Minutes)
150°C	30
175°C	10
185°C	5

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