DH325是專用於生產SMT無鉛錫膏，完全替代國產助焊膏不足的焊接活性助焊膏，采用日本優級原材料研制合成，制作產品可以滿足客戶不同產品的工藝要求,適用生產各種合金粉焊錫膏見(表1)

 DH325lead-free solder paste is a dedicated lead-free solder paste on the SMT production process welding activity to help paste, using superior grade Japanese development of synthetic materials to produce products to meet customer process requirements of different products suitable for producing all kinds of alloy powder paste, see(Table 1)

一、產品特性：

 1、本產品是免清洗焊膏，幾乎無殘留，無需清洗。
 2、極少殘留物是無色透明的,快乾不粘手,較高的絕緣阻抗,不會腐蝕PCB。
 3、優良印刷優良的性能，適用於手工和機器印刷。
 4、連續印刷性能穩定，其粘度變化極小,鋼網上操作壽命可長達8小時以上,保持良好的印刷性能。
 5、可適用不同檔次的焊接設備要求,在較寬的回流焊爐內表現良好的焊接性能。
 6、能夠適應0.3mm間距印刷要求。
 7、良好的潤濕性能，有效解決冷焊點等不良現象。
 8、濕度曲線的技術，減少對各種曲線的依賴。
 9、焊後無錫珠、不連錫。
10、錫點，光澤度好，強度高，良好的電氣性能。
11、尤其是柔性電路，預熱時間可能很短，,都可達到優良的焊接效果。

12、本焊膏生產的成品,濕潤性好,抗發乾性和防冷熱塌陷極好。

一, the product features:
1、This product is no-clean solder paste, very little residue, no cleaning.
2:、The residue is colorless and transparent, quick-drying non-stick in hand, high insulation         resistance, corrosion will not be PCB.
3:、fine print excellent performance, suitable for hand and machine printing.
4、Continuous printing performance is stable, its viscosity changes very little, the steel line operating life of up to 8 hours, and maintain good printing performance.
5:、applicable to different grades of welding equipment requirements, the performance of a wide reflow furnace good welding performance.
6、able to adapt to 0.3mm pitch printing requirements.
7、good wetting properties, an effective solution to cold solder joints and other undesirable phenomena.
8、humidity curve technology to reduce dependence on the various curves.
9、very little very little corrosion after welding residual solder ball.
10、tin point, good gloss, high strength, good electrical performance.
11、in particular, flexible circuits, preheating time may be very short, can achieve good welding effect.
12、The production of finished paste, moist and good, anti-hair dry and anti-collapse excellent hot and cold.

二、合金粉配比

(表1)

三、使用/註意

1、焊膏保存溫度在常溫5-20℃，勿接近高溫處。

2、使用前將焊膏攪拌均勻，倒入合金粉攪拌。

3、攪拌時間根據合金粉份量來定，參考時間:（攪拌機攪拌5-12分鐘）.

4、攪拌溫度控制20-25℃，在攪拌過程中合金粉磨擦會產生溫度會上升，註意觀查合金粉變化。

5、手工攪拌要在乾燥無塵環境中操作，使用不銹鋼材料攪拌。勿使用其它金屬成份接觸錫膏。

Third, use / attention

1, paste stored at room temperature, the temperature 5-20℃, not to close to heat.
2 Stir before using the paste, stirring into the alloy powder.
3, stirring time under the weight of alloy powder to set, reference time: (Mixer 5-12 minutes).
4, mixing temperature control 20-25℃, the alloy powder in the mixing process will produce friction between the temperature will rise, pay attention to changes in view of investigation alloy powder.
5, hand mixing in dry air to operate, so that stainless steel mixing.Do not use the other metal components contact solder paste.

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