FeaturesMaterialsElectricalMechanicalEnvironmentalMating
- High Density for Space Saving.
- Soldering Charge Design to Prevent un-wetting.
- Board to Board Type
- Insertion Loss :
Differential Pair Signaling 18Gbps@-3dB. - Pitch : 1.27 mm
- Pin : 5 Row x 20 Pin , 8 Row x 20 Pin
- Height : 6.61(5 Row) , 7.11(8 Row) mm
- Application : Server,Storage
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- Contact : Copper Alloy
- Housing : High Temperature Thermoplastic UL-94V-0
- Soldering Charge : Tin Alloy
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- Current Rating : 2.9A / Per Pin
- Voltage Rating : 150V AC
- Insulation Resistance : 25,000 MΩ Min.
- Contact Resisance :
Initial : 10 mΩ Max.
After Test : △R 5 mΩ - Dielectric Withstanding Voltage :
900V AC Max. for 1Minute
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- Mating Force : 0.4N / Per Pin Max.
- Unmating Force : 0.1N / Per Pin Min.
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- Operation Temperature : -20℃ to 105℃
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