商品代碼:2382970

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    商品代碼: 2382970
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    商品詳細說明

    Semi Automatic Wafer Mounter

    (Model:SWM-300)

    1. Main Specifications:

          

           1.1  Wafer Size:                 Diameter:     4” , 5” , 6” & 8”

                                                     Thickness:     150 ~ 750 um 

           1.2  Wafer Type:                Si , GaAs

                                                     Single Flat, Double Flat or V-Notch

           1.3  Tape Type:                  Blue Tape or UV Tape

                                                     Width:          210 ~ 300 mm

                                                     Length:         100 ~ 200 m

                                                     Thickness:     0.05 ~ 0.2 mm

           1.4  Wafer Frame:             6” DISCO or K&S

                                                     8” DISCO or K&S

                                                     Customer Specified

           1.5  Mounting Theory:      ESD Roller Mounting

           1.6  Wafer Chuck:             All-in-one Teflon Plating Contact Chuck

           1.7  Input & Output:          Manual Wafer & Frame Loading and Unloading

           1.8  ESD Control:               ESD Teflon Plating Chuck / Tape Transfer Rollers and

                                                     ESD Blower for Mounting Site

           1.9  Cutting System:          Adjustable Ring Cutter

           1.11 Wafer Orientation:   Universal Mark Line

           1.12 Control Unit:             PLC with 5” Touch Panel Screen

           1.13 Power Supplier:         Single Phase AC 220 V, 10A

           1.14 Air:                                   60 PSI CDA , 2 CFM

           1.16 Machine Construction:    Made of Full Aluminium Profile

           1.17 Machine Cover:        SUS304 Stainless Steel Sheet and ESD PMMA

           1.18 Dimensions:                     620 mm (W)×1000 mm (D)×1500 mm (H)

           1.19 Net Weight:               180 kg

     

    2. Machine Performance:

          

           2.1  Wafer Yield:              >=99.9%

           2.2  Mounting Quality:      No Air Bubble (not include particle bubble)

           2.3  UPH:                          >=80 PCs Wafer

    2.4  Conversion Time:      <=5 Minutes



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