Semi Automatic Wafer Mounter
(Model:SWM-300)
1.1 Wafer Size: Diameter: 4” , 5” , 6” & 8”
Thickness: 150 ~ 750 um
1.2 Wafer Type: Si , GaAs
Single Flat, Double Flat or V-Notch
1.3 Tape Type: Blue Tape or UV Tape
Width: 210 ~ 300 mm
Length: 100 ~ 200 m
Thickness: 0.05 ~ 0.2 mm
1.4 Wafer Frame: 6” DISCO or K&S
8” DISCO or K&S
Customer Specified
1.5 Mounting Theory: ESD Roller Mounting
1.6 Wafer Chuck: All-in-one Teflon Plating Contact Chuck
1.7 Input & Output: Manual Wafer & Frame Loading and Unloading
1.8 ESD Control: ESD Teflon Plating Chuck / Tape Transfer Rollers and
ESD Blower for Mounting Site
1.9 Cutting System: Adjustable Ring Cutter
1.11 Wafer Orientation: Universal Mark Line
1.12 Control Unit: PLC with 5” Touch Panel Screen
1.13 Power Supplier: Single Phase AC 220 V, 10A
1.14 Air: 60 PSI CDA , 2 CFM
1.16 Machine Construction: Made of Full Aluminium Profile
1.17 Machine Cover: SUS304 Stainless Steel Sheet and ESD PMMA
1.18 Dimensions: 620 mm (W)×1000 mm (D)×1500 mm (H)
1.19 Net Weight: 180 kg
2.1 Wafer Yield: >=99.9%
2.2 Mounting Quality: No Air Bubble (not include particle bubble)
2.3 UPH: >=80 PCs Wafer
2.4 Conversion Time: <=5 Minutes
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