◆Viewing angle:120 deg
發光角度：120℃
◆The materials of the LED dice is InGaN
芯片成分
◆2.0mm×1.2mm×0.75mm SMT-LED
外型尺寸
◆Lens Appearance: Water Clear
膠體顏色：水色透明
◆ RoHS compliant lead-free soldering compatible
符合ROHS（危害物質禁用指令）要求。
參數 | 符號 | 值 | 單位 |
Power dissipation功率耗損 | Pd | 65 | mW |
Forward current正向電流 | If | 30 | mA |
Reverse voltage反向電壓 | Vr | 5 | V |
Operating temperature range工作溫度范圍 | Top | -40~+85 | ℃ |
Storage temperature range貯存溫度范圍 | Tstg | -40~+100 | ℃ |
Peak pulsing current最大脈沖電流 | Ifp | 100 | mA |
Electrostatic Discharge抗靜電能力 | ESD | 2000(HBM) | V |
NOTE: IFP Conditions: Pulse Width≦10msec. and Duty cycle≦1/10.
IFP條件：脈沖持續時間≦10msec，占空因素≦1/10
Parameter 參數 | Test Condition 測試條件 | Symbol 符號 | Value值 | Unit 單位 | ||
Min. | Typ. | Max. | ||||
Forward voltage 正向電壓 | If=20mA | VF | 2.0 | -- | 2.4 | V |
Luminous intensity 發光強度 | If=20mA | Iv | 150 | -- | 200 | mcd |
Dominant wavelength 主波長 | If=20mA | WLD | 620 | -- | 630 | nm |
Viewing angle at 50% Iv 半功率角 | If=20mA | 2 θ 1/2 | -- | 120 | -- | Deg |
Reverse current 反向電流 | Vr=5V | Ir | -- | -- | 10 | mA |
NOTE: 1. Tolerance of luminous intensity is±10%
發光強度公差為±10%
2. Tolerance of forward voltage is±0.05V
正向電壓公差±0.05v
※ Pb-free Solder temperature Profile無鉛產品回流焊溫度條件曲線規范 Note: a)Reflow soldering should not be done more than two times. 材料焊接次數不超過2次。 b)Do not put stress on the LEDs when soldering. 焊接時請不要重壓LED燈。 c)Do not warp the circuit board before it have been returned to normal ambient conditions after soldering. 焊接後溫度未回降到常溫時請勿扭曲線路板。 The temperature of the iron should be lower than 300℃and soldering within 3sec per solder-pad is to be observed. 手工焊接時，烙鐵溫度不高於300℃，每個焊腳焊接時間不超過3秒 1. Do not open the moisture proof bag before ready to use the LEDs 請在未準備使用LED之前不要打開防靜電袋子。 2. The LEDs should be kept at 30℃or less and 60%RH or less before opening the package. The max. storage period before opening the package is 1 year. LED在未開封之前應保存在30℃以下，濕度在60%以下的環境中，最長保存期為1年。 3. After opening the package, the LEDs should be kept at 30℃/40%RH or less, and it should be used within 7 days 打開包裝待後，LED需保存在30℃/40%濕度以下的條件，且必須在7天內使用完。 4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking condition as below: 60±5℃for 12 hours 如果LED超出瞭第3點要求，則LED必須經過烘烤才能使用，烘烤條件為：60±5℃，12個 小時試驗類別Classification 試驗項目
Test Item試驗條件
Test Condition試驗設備
Test Equipment樣品數
Sample Size失敗率
Failure Rate耐久性試驗
Endurance Test室溫通電試驗
Operation LifeTemp=(25±5)℃ RH=(50±10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs 燒機板
Burn in board20 0 高溫高濕儲存試驗
High Temperature High Humidity StorageTemp=(85±5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs 可程式恒溫恒濕試驗機
Programmable Temp & Humidity Chamber20 0 高溫高濕反向耐壓試驗
High Temperature High HumidityReverse BiasTemp=(85±5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs 可程式恒溫恒濕試驗機
DC=5V電源Programmable Temp & Humidity ChamberPower:DC=5V20 0 高溫儲存試驗
High Temperature StorageHigh Temp=(85±5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs 烤箱
Oven20 0 低溫儲存試驗
Low Temperature StorageLow Temp=(-30±5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs 可程式恒溫恒濕試驗機
Programmable Temp & Humidity Chamber20 0 環境試驗
EnvironmentalTest溫度循環試驗
Temperature Cycle Test(85±5) ℃ ~ ( -30℃±5) ℃ ~ (85±5) ℃30min 120min 30 min 100minTest time: 0 cycle 10cycle 50cycle 100cycle 可程式恒溫恒濕試驗機
Programmable Temp & Humidity Chamber20 0 冷熱沖擊試驗
Thermal Shock Test(110±5) ℃ ~ ( -30℃±5) ℃ ~ (110±5) ℃15min 8min 15 min 8minTest time: 0 cycle 10cycle 50cycle 100cycle 氣體式冷熱沖擊試驗機
Thermal Shock Tester (Air to Air)20 0 回流焊試驗
Solder ResistanceTemp=260±5℃ Dwell Time=10±1sec; Test times=5 times 回流焊試驗機
Reflow Oven20 0 焊接特性試驗
Solder abilityTemp=230±5℃ Dwell Time=5±1sec; 錫爐
Tin furnace20 
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