UP78 OSP BGA PASTE FLUX NO-CLEAN PASTE FLUX This No-clean paste flux is engineered to be soft and non-tacky to allow the lowest level of false rejects during pin testing. The post reflow residue is clear, colourless and penetrable enough to allow easy ATE compatibility (pin testability). This BGA flux provides good tack properties for holding solder spheres in place for IC package bumping or repair. PHYSICAL, CHEMICAL AND ELECTRICAL PROPERTIES OF FLUX Colour Light Amber Tack Force (J-STD-005) > 2.0 g/mm2 @ 6 hours (71%, 25C) Stencil Life > 8 hours Reflow Residue 48 % w/w, tack free after reflow Copper Mirror Test Passed (L type) Silver Chromate Paper Test Passed Fluoride Test Passed Surface Insulation Resistance Test IPC-J-STD-004 (7 days, uncleaned) > 2.0 x 10E9 ohms, Passed Bellcore TR-NWT-000078 > 2.9 x 10E13 ohms, Passed (4days, uncleaned) Electromigration (500 hours Bellcore) Initial -5.8 x 10E8 ohms Final -1.1 x 10E9 ohms SIR Passed, Passed visual with no corrosion
批發市場僅提供代購諮詢服務，商品內容為廠商自行維護，若有發現不實、不合適或不正確內容，再請告知我們，查實即會請廠商修改或立即下架，謝謝。
