專業生產激光打標機|半導體打標機|激光打標機設備|首飾打標機_半導體設備_電工電氣_貨源

HL-DP半導體打標機HL-DP semi-conductor marking machine

HL-50DP

HL-100DP

【機型簡介】Means of indicators
合力半導體激光打標機采用國際上最先進半導體泵浦技術，體積小，能耗低，光模式好，打標更精細，取代燈泵浦激光打標機的新一代打標設備產品可以長時間高負荷運行，光斑精細，功率大，效率高，能耗低，免維護，適合對打標要求高的產品進行高速或在線精密打標。
Heli semiconductor laser marking machine adopts the most advanced semiconductor pump technology, small size, low energy consumption, lightmodel is good, marking a more sophisticated, replace lamp pumped laser marking machine marking a new generation of equipment, products canbe a long time high load, spot fine, big power, high efficiency, low energy consumption, maintenance-free, suitable for rally marked the products that require high precision high-speed or line marking.
【具體特點】Specific features
1.采用全封閉結構的光學系統，光束質量好，轉換效率高，配有光路預覽和紅光焦點指示功能；
2.光模式好，光斑細，通過高精度超速掃描振鏡的控制，打標速度快，標記線條更精美；
3.軟件功能完善、界面友好，具光路預覽功能，直觀準確；
4.該機器配備最新的外置水冷系統，運行噪音極低，溫度調節精度高，為機器長時間超負荷運行提供瞭可靠的保障。

5.具有系統體積小，外形美觀大方，采用最新型的外置水冷系統，運行噪音低，溫度調節精度高；

6.具有整機運行成本低，安裝及操作簡便，打標定位精度高，速度快的特點；

7.可在各種金屬材質或硬質非金屬材料上進行靜態精細打標，也可以配合生產流水線進行在線飛行打標。

8.與眾不同的光學模式，低階模輸出，光學質量好，刻線更細；

9.性能穩定免維護，適合各種惡劣環境，半導體激光模塊使用壽命10000小時以上；

10.光電轉換效率高；

11.一體化設計，減少占地面積；

12.模塊化設計，易於維修。

13.優化的人機工程，固定的臺面，減少體耗。

1.Adopt to closed cycle structure of the optical system, the conversion beam of good quality and efficiency, with a light red indicates a preview of the road and the focal point system function；
2.Light mode is good, spot fine, high-precision control of speed scanning galvanometer, marking speed, marking the line more attractive;

3.Software functional, user-friendly, with optical preview function, intuitive and accurate;

4.The machine is equipped with the latest external water cooling system running extremely low noise, high precision temperature control for the machine to provide a reliable long running overload protection.

5.A small size, is in great shape, use the latest addition to the cold water system, low noise, temperature, and adjust the precision；

6.The integrated equipment running cost is low, the installation and operation simple and direction of high precision, the faster characteristics；

7.In all sorts of metal materials or hard nonmetal material on a specific static, you can also cooperate with the production of an on-line flying in the pipeline

8.Different optical patterns and lower molds output, optical good quality, more fine；

9.Performance from the maintenance of stability for all sorts of adverse circumstances, the semiconductor laser module life, hours or more；

10.Photovoltaic conversion efficiency；

11.Integration design. it covers an area；

12.Modular design, easy to repair;

13.The man-machine engineering, fixed table-board and reduce the consumption.

【詳細配置】Detailed configuration

A.可高度適應惡劣環境的工業計算機

B.美國進口射頻激光器

C.美國進口透鏡及擴束聚焦系統

D.美國進口高檔升降平臺

E.工業冷水機

F.工業控制計算機及DP半導體電源系統

a.Industrial control computer adapt the bad environment of processing scene

b.High speed scanning vibrating mirror imported from USA

c.Radio frequency CO2laser instrument imported fromUSA

d.F-Olens and expanding bunch system imported fromUSA

e.Industrial water-cooled engine

f.Industrial control computer and the DP semiconductor power system

【技術參數】Technical-parameters

型號/Type HL-50DP HL-100DP

激光類型/Laser type 半導體激光模塊/semiconductor laser blockset

響應時間/Response time 0.8ms

激光波長/Laser wavelength 1064nm

激光功率/Laser power 0~50w連續可調 0~100連續可調

打標范圍/Labeling scope 100*100mm 200*200mm(可選/optional)

打標線速/ Labeling speed 7000mm/s

最小線速/ Minimum line width 0.1/0.15mm 0.1/0.15/0.3mm

重復定位精度/Repeating locating ±0.003mm

平均功耗/Average power consumption ≤2.5kw ≤3.5kw

冷卻方式/Cooling mode 風冷/Air Cooling 水冷/Water Cooling

外形尺寸/Size 1200*600*1250mm 1700*1000*1250mm

重量/GM 100kg 260kg

【適用材料】Applicable Materials
半導體激光打標機可雕刻金屬及多種非金屬材料,半導體激光打標機適用材料：普通金屬及合金（鐵、銅、鋁、鎂、鋅等所有金屬），稀有金屬及合金（金、銀、鈦），金屬氧化物（各種金屬氧化物均可），特殊表面處理（磷化、鋁陽極化、電鍍表面），塑膠及ABS料（電器用品外殼，日用品），油墨（透光按鍵、印刷制品），環氧樹脂（電子元件的封裝、絕緣層），陶瓷和矽晶片。

Semiconductor laser marking machine can engraving metals and a variety of non-metallic materials, semiconductor materials, laser marking machine is suitable for: general metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver , titanium), metal oxide (metal oxide may be), special surface treatment (phosphate, aluminum anodizing, plating surface), plastic and ABS material (electrical appliances, housing, commodities), ink (translucent button printing products), epoxy resin (encapsulation of electronic components, insulation layer), ceramic and silicon chips.

【適用行業】Applicable Industry

電子元器件、集成電路（IC）、塑膠按鍵、食品或醫藥包裝等進行流水打標;建材、PVC管材、五金制品、樂器、潔具浴具、工具配件、精密器械、眼鏡鐘表、汽車配件、建材、醫療器械、太陽能等行業產品的打標深加工。

Electronic components, integrated circuits (IC), plastic buttons, food or medicine packaging for water marking; building materials, PVC pipe, hardware, musical instruments, bath ware, tools, accessories, precision instruments, eyeglasses and clocks, auto parts, building materials , medical equipment, solar energy products, marking the industry processing.