產品品牌：合力激光

HL-DP半導體打標機【機型簡介】Means of indicators
合力半導體激光打標機采用國際上最先進半導體泵浦技術，體積小，能耗低，光模式好，打標更精細，取代燈泵浦激光打標機的新一代打標設備產品可以長時間高負荷運行，光斑精細，功率大，效率高，能耗低，免維護，適合對打標要求高的產品進行高速或在線精密打標。
Heli semiconductor laser marking machine adopts the most advanced semiconductor pump technology, small size, low energy consumption, lightmodel is good, marking a more sophisticated, replace lamp pumped laser marking machine marking a new generation of equipment, products canbe a long time high load, spot fine, big power, high efficiency, low energy consumption, maintenance-free, suitable for rally marked theproducts that require high precision high-speed or line marking
【具體特點】Specific features
半導體激光打標機電光轉換效率高，體積小，功耗低，使用費用低廉；
進口器件，光學系統全封閉結構，設備可靠性高、穩定性好；
光模式好，光斑細，通過高精度超速掃描振鏡的控制，打標速度快，標記線條更精美；
軟件功能完善、界面友好，具光路預覽功能，直觀準確；
該機器配備最新的外置水冷系統，運行噪音極低，溫度調節精度高，為機器長時間 超負荷運行提供了可靠的保障。
Semiconductor laser marking Electrical and optical conversion efficiency, compact, low power consumption, using low-cost;Import devices, optical system fully enclosed structure, equipment, high reliability and stability;Light mode is good, spot fine, high-precision control of speed scanning galvanometer, marking speed, marking the line more attractive;Software functional, user-friendly, with optical preview function, intuitive and accurate;The machine is equipped with the latest external water cooling systemrunning extremely low noise, high precision temperature control for the machine to provide a reliable long running overload protection.【技術參數】Technical-parameters類型/Type HL-50DP   HL100DP激光類型/Laser type         CO2激光器 /hermetic and detached co2 laser tube響應時間/Response time       0.8ms激光波長/Laser wavelength     10640nm激光功率/Laser power        0~50w連續可調   0~100連續可調打標范圍/Labeling scope        100*100mm  200*200mm(可選/optional)打標線速/ Labeling speed        7000mm/s最小線速/ Minimum line width   0.1/0.15mm     0.1/0.15/0.3mm重復定位精度/Repeating locating       ±0.003mm平均功耗/Averaqe power consumption       ≤50kw   ≤100kw冷卻方式/Cooling mode         風冷/Air Cooling     水冷/Water Cooling外形尺寸/Size                   1200*600*1250mm    1700*1000*1250mm重量/GM        100kg   260kg【適用材料】Applicable Materials
半導體激光打標機可雕刻金屬及多種非金屬材料,半導體激光打標機適用材料：普通金屬及合金（鐵、銅、鋁、鎂、鋅等所有金屬），稀有金屬及合金（金、銀、鈦），金屬氧化物（各種金屬氧化物均可），特殊表面處理（磷化、鋁陽極化、電鍍表面），塑膠及ABS料（電器用品外殼，日用品），油墨（透光按鍵、印刷制品），環氧樹脂（電子元件的封裝、絕緣層），陶瓷和硅晶片。Semiconductor laser marking machine can engraving metals and a variety of non-metallic materials, semiconductor materials, laser marking machine is suitable for: general metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver , titanium), metal oxide (metal oxide may be), special surface treatment (phosphate, aluminum anodizing, plating surface), plastic and ABS material (electrical appliances, housing, commodities), ink (translucent button printing products), epoxy resin (encapsulation of electronic components, insulation layer), ceramic and silicon chips.
【適用行業】Applicable Industry 電子元器件、集成電路（IC）、塑膠按鍵、食品或醫藥包裝等進行流水打標;建材、PVC管材、五金制品、樂器、潔具浴具、工具配件、精密器械、眼鏡鐘表、汽車配件、建材、醫療器械、太陽能等行業產品的打標深加工。Electronic components, integrated circuits (IC), plastic buttons, food or medicine packaging for water marking; building materials, PVC pipe, hardware, musical instruments, bath ware, tools, accessories, precision instruments, eyeglasses and clocks, auto parts, building materials , medical equipment, solar energy products, marking the industryprocessing.