商品代碼:4006318

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    供應型號ASAP-1 Digital Preparation System
    商品代碼: 4006318
    (可點擊以下立即詢價直接線上諮詢,或來電提供此商品代碼諮詢)
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    商品詳細說明



     

    Product Highlights

    • Suits all sizes of die-package, wafer and board-level
    • Real Time Video Monitor with system parameters
    • Touchscreen control with physical joystick &controls
    • Rigidized Table Assembly and closed-loop,high-torque,motor control enhances the machiningof tough and hard materials
    • X,Y and Zaxes all have deep sub-micron accuracy
    • Accurately decaps, then thins substrate and polishes
    • Patented Floating Head provides a true polishing action-yields polishing quality & high survivability
    • Intuitive menus provide a powerful, easy to use ,system
    • USB Flash Drive interface for preparation  recipe storage
    • Short set-up and process times
    • Accurate die-tilt adjudtment  'on the fly'
    • Bench-top &Quiet in Operation

    Equipment

    Order code   Item               Description                                                                    
    6760.1ASAP-1®IPS with ULTRACOLLIMATORDIGITAL Selected Area Preparation System,100-240v 50/60Hz.Includes:X-Y table,tool spindle drive with deep sub-micron Z-resolution, tilt-table, touch-screen programming unit ,ULTRACOLLIMATOR optical alignment, integrated real-time machine vision,6.5inch Icd monitor ,set of 2mm and3mm tools.
    6760.2 ASAP-1®IPS DIGITAL Selected Area Preparation System,100-240v,50/60Hz.Includes:X-Ytable,tool spindle drive with deep sub-micron micron Z-resolution, tilt-table, touch-screen programming unit ,ULTRACOLLIMATOR optical alignment, integrated real-time machine vision,6.5inch Icd monitor ,set of 2mm and3mm tools.
    6715.1 High torque Motor  (upgrade) 3X Torque motor ,Suits aggressive material requirements such as removal of thick heat-sinks ,removal of metals.
    6780.1 Particulate Vacuum Pump Upgrade to allow for removal of package particulates during the decapsulation process .Modular
    6366.2 Thermal Stage Upgrade to enable in-situ Die Curvature Stress Relaxation,with rapid sample transfer. Temperature controlled by main IPS unit. Upgrade of original stage introduced in 2004.Modular.


     

    Feature                                            Description                                                                
    Z-Vertical Direction 0.04microns(40nanometers)
    Table Precision(X&Y Travel)0.2microns(200nanometers)

    Table Travel Amplitude

     100mm×100mm
    Polishing Method Patented ASAP-1 Float-down head, with lock
    Video Real-time machine vision on in-situ 6.5 inch video monitor.External Video Output
    Programming Method Touch screen with joystick and 3 rotary encoders
    Tilt Control Computer-aided tilt control X&Y,ULTRACOLLIMATOR(option)
    Force Control GRAPHICAL force feedback interface
     Force Precision 1 gram precision ,overall accurancy+/-10grams
     X-Y and Z Positioning Method Laser Targeting
     Edge Detect LASER detect
     Recipe Load & Save USB Port ,for removable thumb-drive(up to 2Gb)
    dro Down Indication LASER and Force-feedback sensors
    Power Consumption 300 Watts maxmum in use
    Power Universal:100-120VAC ;200-240VAC

     

    本網站價格為標準報價,僅供參考。如需進一步瞭解詳細信息以及優惠價格請聯系我們。

    電話:

         銷售一:0512-87775859  137-7178-7343

         銷售二:0512-87775861

         銷售三:0512-87775862

         銷售四:0512-87775863

    QQ:1012123899

    微博:浩高電子科技

    微信公眾賬號:higotech

    郵箱:[email protected]

    企業文化:浩鴻遠博,高科精工



     



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